Nvidia CEO says its advanced packaging technology needs are changing
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders.
Nvidia CEO Huang confirms its TSMC advanced packaging needs are shifting: report
CEO Jensen Huang confirmed its advanced packaging needs from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) are changing, according to a report by Reuters. Blackwell, Nvidia's latest artificial intelligence chip,
Nvidia Continues Strong Demand for Taiwan Semiconductor's Advanced Packaging Despite Technology Shifts
Nvidia's demand for advanced packaging from Taiwan Semiconductor remains strong despite evolving technology; plans to use CoWoS-L for Blackwell chip.
Nvidia Expands Capacity with TSMC's Advanced Packaging
Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The company aims to increase capacity, not reduce it, as demand grows. Jensen Huang,
Nvidia's visit to SPIL highlights its emphasis on advanced packaging
Nvidia CEO Jensen Huang's visit to Siliconware Precision Industries (SPIL) on his current trip to Taiwan has garnered market attention to the company's emphasis on advanced packaging.
Nvidia CEO says advanced packaging needs are changing
TAICHUNG, Taiwan (Reuters) -- Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders.
Nvidia increases demand for TSMC's advanced packaging
Nvidia (NASDAQ:NVDA), the U.S. AI chip giant, continues to demand advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC), its main contract chipmaker, although the type of technology it requires is shifting,
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Nvidia shifts to CoWoS-L packaging for Blackwell GPU production ramp-up
As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders ...
Nvidia Just Made a Huge AI Chip Shift--And It Could Shake Up the Entire Industry
Nvidia ( NASDAQ:NVDA) is making a major shift in its AI chip packaging strategy, transitioning from CoWoS-S to CoWoS-L as it ...
Taiwan takes a further step in production of AI chips with advanced new plant
Taiwan has taken another step in enhancing its key role in the production of advanced semiconductor chips used for artificial intelligence with the inauguration of a new plant by Siliconware Precision ...
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Nvidia reportedly prioritizing dual-die Blackwell GPUs with CoWoS-L packaging
Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.