During the Year of the Dragon, the TAIEX rose 5,429.34 points, the highest ever, while the 30 percent increase in the year ...

The ratio of orders fulfilled by Taiwanese manufacturers overseas has consistently declined over the past several years after ...

Discussions also took place on next-generation advanced packaging technology (CoWoS-L) necessary for AI accelerator manufacturing, as well as processes that are nearing commercialization, such as ...

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...

Advt "As we move into Blackwell, we will use largely CoWoS-L. Of course, we're still manufacturing Hopper, and Hopper will ...

The Apple AirTag is nothing short of a genius invention. A handy little tracking device that can be attached to almost ...

Sony has confirmed the cancellation of two in-development live-service games, one of which was based in the tumultuous God of ...

Nvidia CEO shortens visit due to crowding, also visited Siliconware Precision Industries | Jan. 17, 2025 18:31 ...